REN Series – Rugged Embedded Nodes
Built for edge computing in harsh environments, the REN Series gives engineers the freedom to configure rugged, conduction-cooled systems that meet the specific needs of their applications. From compact builds to rack-mount systems, REN offers flexibility, reliability, and speed to deployment.
From Idea to Field, Faster.
Small Form, Big Possibilities
The REN Mini is the compact entry point into the REN Series, designed for edge applications that demand serious compute power in a small, rugged form factor. Hosting PCIe/104 stacks or VersaLogic ESU modules, it offers a flexible foundation for industrial AI, sensor fusion, or control systems where space is at a premium. Fully sealed and conduction-cooled, the REN Mini brings resilience and adaptability to demanding environments.
Hybrid Power, Standard Fit
The REN 19-14 STD is a 2U rack-mount platform designed for hybrid processing at the edge. At 14 inches deep, it combines the flexibility of VPX with VersaLogic’s EPU and ESU modules, offering engineers a “ready-to-configure” rugged chassis that accelerates integration. With customer-defined I/O plates, storage, and power supply options, the REN 19-14 STD delivers adaptable compute power for industrial and defence applications.
Rugged VPX, Ready for the Edge
The REN 19-14 VPX is a 2U, 14-inch deep rack-mount chassis built for SOSA-aligned VPX card sets. Its ruggedised, fully sealed design makes it especially suited for marine and other edge environments where conduction cooling and resilience are critical. With room for high-performance VPX modules and configurable I/O, the REN 19-14 VPX enables engineers to deploy advanced compute systems rapidly and reliably.
Extended Depth, Expanded Potential
Building on the 14-inch version, the REN 19-17 STD provides a deeper chassis for applications requiring more space for power, storage, or expanded I/O. Like all REN systems, it is conduction-cooled and sealed against the elements, making it ideal for engineers seeking a flexible yet rugged platform to prototype, integrate, and deploy hybrid compute solutions in tough environments.
More Depth, More Headroom
The REN 19-17 VPX takes the same proven rugged design as the 14-inch version and extends it to 17 inches deep, giving engineers greater headroom for power and storage requirements. Designed for VPX FlatPAK assemblies, this chassis ensures engineers can bring advanced signal processing, AI, and control applications to the edge with maximum reliability in harsh environments.
Prototype. Prove. Deploy.
The REN VPX 4-Slot (Vetronics) is designed for engineers who need both flexibility in development and reliability in deployment. Its removable 4-slot inner card rack allows easy bench testing, evaluation, or card development—ideal for labs, integration houses, or early prototyping. When ready, the rack is bolted into the ruggedised outer chassis, thermally bonded on all sides, ensuring full conduction cooling and mechanical resilience. Supporting SOSA-aligned VPX cards and tailored I/O, it provides a true two-in-one solution that shortens the path from concept to mission-ready system.
Focused Power, Minimal Footprint
The REN VPX FlatPAK is a single-slot conduction-cooled carrier that allows engineers to host 3U or 6U VPX cards in a compact, rugged form factor. Perfect for airborne and electronic warfare applications, the FlatPAK enables quick evaluation, upgrades, or focused deployments where space is tight and resilience is essential.
Important note: The REN VPX FlatPAK is designed to dissipate heat quickly into its host structure. It will not cool a VPX card on its own.
Pick up the gauntlet thrown by Unitronix and rethink and reshape the future of humanity. We have a box – a project box – you decide what’s inside and how it’s configured.
If you’re ready to tackle the challenges of emerging technologies head-on and transform your vision into reality, REN™ is here to empower you. Step into the future of engineering, where possibilities are limitless and solutions are boundless.
All REN boxes are reusable, reconfigurable and recyclable, cutting carbon footprint and saving cost.
THE FUTURE BEGINS HERE:
Reach out to our experts and let’s craft your vision together.
Choose from a range of chassis designs, processors, power options and storage configurations, ensuring it aligns perfectly with your goals.

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